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AMD Ryzen 3000 chips will continue to use solder through the entire CPU stack

AMD will continue to use solder in the Ryzen 3000 series of desktop CPUs to connect the different dies to the main heat spreader. That will probably not come as much of a surprise to regular readers, given that the Ryzen 2000 and the more-recent 3000-series APUs have all come soldered, but it is still welcome news. Especially for overclockers, though it’s not going to stop De8auer from delidding the crap out of his chips…

It’s also arguably more important for the new Zen 2 chiplet design given that there are up to three distinct dies which need to be cooled under that plain AMD lid. How the air gap between the I/O chip and either the one or two other chiplet dies will come to impact the heat the new Ryzen 3000 CPUs generate is still up for debate. It’s also going to be interesting just how coolers will cope with the offset heat generation of the new chips too.

But it has now been confirmed, from the keynote show floor, that AMD will be using solder for all the new AM4 Zen 2 SKUs, from the 12-core Ryzen 9 chip and down through the stack.